JOINT VENTURE
· Guilin GLSUN Science and Tech Group Co.LTD , CHINA
· AGX TECHNOLOGIES, INC., USA
GOAL
· BECOME THE PREMIER LASER DIODE MANUFACTURER IN CHINA.
LASERCOM STRENGTHS
· Staff with strong combination of proven experience in design and production of high performance and high volume laser diode chips.
· Many proprietary designed tools and processes improve yields and throughput relative to competitors.
· Experienced in both BH and Ridge designs and processing.
· BH for high performance & Ridge for lower cost.
WAFERFAB DESIGN
· Designed from ground up for manufacturing efficiency in laser diodes.
· Initial target DFB chip capacity 2KK/month.
· Low operating cost & High efficiency layout.
· State of art design, optimized for manufacturing semiconductor laser diodes.
· Heavy use of automated/semi-automated processing equipment.
· Initial target DFB chip capacity 2KK/month.
· Expandable to 5KK/month with additional equipment.
EXPERIENCED ENGINEERING & MANAGEMENT
· Engineering, R&D and management staff previous accomplishments.
· Held primary production roles in Finisar, Ortel/Emcore and Archcom waferfabs.
· Built two waferfabs for laser diode manufacturing in USA.
· Created world leading manufacturing facility and business in pointer lasers.
WEBSITE
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