GLsun General Manager Mr. Chen Chunming presented a report on the update of DFB-LD chips production and packaging project, at the ceremony held on December 8, 2020.

GLsun DFB-LD chips production and packaging project officially started construction in February 2018, and was listed into "Double Hundred Double New" Project by Guangxi Zhuang Autonomous Region in 2019. By November 2020, the project was successfully completed and officially put into production, and an annual production of 50 million DFB-LD chips and components can be realized once it reaches full design capacity.

"Double Hundred Double New" is a major provincial-level strategic project of Guangxi Zhuang Autonomous Region. "Double Hundred" refers to major industrial projects with investment or production value of over 10 billion Chinese yuan. "Double New" refers to new industrial/tech projects (key projects of strategic emerging industries, new business forms or models, transforming/upgrading traditional industries using new technologies).

GLsun specializes in high-level semiconductor laser diode chips development, production and packaging, focus on both Cloud Data Center and Telecom Networking Inter-connectivity. With a wide production portfolio, our capabilities span the entire industrial chain, and we welcome cooperation with domestic and overseas enterprises to build a bright future of optoelectric communications.